发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve adhesive properties of insulating resin and a conductor and electric reliability as a circuit board as to a both-sided/multi-layered printed wiring board which has inter-layer conduction with a conductor projection part formed on a base-side conductor. SOLUTION: Copper foil 13 is joined directly to a tip 12A of the conductor projection part 12 across no inclusion in an area where it is joined to a tip 12B of the conductor projection part 12, and in an area where a base material 11 and an insulating film 14 are stuck and an area where the copper foil 13 and insulating film 14 are stuck, anti-corrosive coatings 16 and 17 are present between them. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049609(A) 申请公布日期 2006.02.16
申请号 JP20040229123 申请日期 2004.08.05
申请人 FUJIKURA LTD 发明人 INATANI YASUSHI;UNAMI YOSHIHARU
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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