| 摘要 |
An electroless metal deposition method includes pretreating a substrate with a solution including an admixture of an ammonium-based hydroxide and water and removing the solution, without any subsequent additional pretreatment, contacting the substrate with an electroless deposition bath, and depositing a metal layer. The metal may consist of nickel. The bath may exhibit a self-initiation temperature and the pretreating may reduce the self-initiation temperature in comparison to an otherwise identical method lacking the pretreating. Another deposition method includes pretreating a conductive surface of a substrate with a solution exhibiting a second pH greater than a first pH of an electroless deposition bath but no less than 9, contacting the substrate with the bath, and depositing a nickel layer. The substrate may include a conductive surface within an opening having an insulative sidewall surface. The opening may include a contact via such that the conductive surface is within the contact via.
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