摘要 |
Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles (460, 566) are formed in a layer (500) prior to the layer (500) being bonded onto another portion (440) of the device. Forming the nozzles (460, 566) in the layer (500) prior to bonding enables forming nozzles (460, 566) that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles (460, 566) can reduce the resistance to ink flow as well as improve the uniformity of the nozzles (460, 566) across the microelectromechanical device. |
申请人 |
DIMATIX, INC.;CHEN, ZHENFANG;BIBL, ANDREAS;HOISINGTON, PAUL, A. |
发明人 |
CHEN, ZHENFANG;BIBL, ANDREAS;HOISINGTON, PAUL, A. |