发明名称 WIRING BOARD WITH BUILT-IN PARTS AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To secure reliability at higher levels in a wiring board with built-in parts and to provide its manufacturing method. <P>SOLUTION: The wiring board with built-in parts comprises: conductive embedded layers formed in a board thickness direction without revealing in the upper and lower sides of the board; electric/electronic parts with terminals embedded in the board so that the terminals might counter the embedded conductive layer; a connection material for connecting the terminals and conductive layers electrically and mechanically having an upper and lower directional size incorporated in an upper and lower directional dimension of the conductive layer, in the gap provided between the terminals of embedded electric/electronic parts and the conductive layers; and two upper and lower insulating layers provided so that they might cover the surface except the part connected to the connection material among the surfaces outside the embedded electric/electronic parts and might stick to the board thickness direction of the upper and lower sides of electric/electronic parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006049457(A) 申请公布日期 2006.02.16
申请号 JP20040226323 申请日期 2004.08.03
申请人 DT CIRCUIT TECHNOLOGY CO LTD 发明人 SASAOKA KENJI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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