发明名称 |
Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same |
摘要 |
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 mum thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
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申请公布号 |
US2006035169(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20050258273 |
申请日期 |
2005.10.26 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
SAITO KOJI;MISUMI KOUICHI;OKUI TOSHIKI;KOMANO HIROSHI |
分类号 |
G03C1/76;G03F7/027;G03F7/004;G03F7/038 |
主分类号 |
G03C1/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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