| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device constituted of power semiconductor elements in which lead frames and a plurality of pads are arranged, bumps for electrically connecting them and a resin sealing body for carrying out one side sealing of them and a method for manufacturing the semiconductor device by simplifying a burr removing process without generating any burr by deforming the shape of the lead frame projected on the side face of the resin sealing body. <P>SOLUTION: The lower face of each of a plurality of leads 2 is exposed from the lower face of a resin sealing body 4, one end of the lead is projected from the side face of the resin sealing body, and the lead projecting part is deformed so as to be made thinner than the other resin-sealed part, and the upper face of the lead projecting part is positioned within the same plane as the other part of the lead upper face, and the lower face of the lead projecting part is formed with a difference 7 in level from the other part of the lead lower face. The lead projecting part is held and pressurized between a lower metallic mold 6 whose peripheral part is thick and an upper metallic mold 5 so that the thin part can be formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
