| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce mounting failure by eliminating burr and peeling in a sealing resin generated at a lead section that becomes an external terminal when manufacturing a resin-sealed semiconductor device by collective sealing. <P>SOLUTION: When manufacturing the plurality of resin-sealed semiconductor devices 1 by using a lead frame 7 in which unit patterns having a die pad section 2 and a lead section 4 are connected by a frame 9 for arrangement, two processes are made, namely a process for setting the lead frame 7 in a sealed mold 12 with a sealing sheet 16 interposed between the rear side of the lead frame 7 and the sealing mold and resin-sealing the entire lead frame 7 by a sealing resin 6; and a process for separating the collectively molded resin-sealed body 13 from the sealing sheet 16, and cutting the resin-sealed body 13 along the frame 9 for dividing into individual semiconductor devices 1. The sealing sheet 16 is used and the adhesion properties of the lead section 4 to the sealing sheet 16 are secured by a support section 17, thus avoiding the deterioration of peeling resistance properties caused by a resin film and preventing resin burr from being generated at the rear side of the lead section 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
