| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated structure for flexible circuit board, which has superior adhesive property, thermal resistance and dimension stability and can improve productivity. SOLUTION: In the manufacturing method of the laminated structure for flexible circuit board, a base film is surface-processed and a tie layer is formed. The base film is surface-processed by irradiating it with ion beams using oxygen argon mixed gas. COPYRIGHT: (C)2006,JPO&NCIPI |
