| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel process for patterning by depositing an organic semiconductor layer in an organic electronic device. SOLUTION: A substrate having a surface is prepared (100). On the substrate, a gate electrode, a source electrode, and a drain electrode, and a gate dielectric layer are formed, in advance. Further, a semiconductor raw material is deposited so as to come into contact with the gate dielectric layer, the source electrode, and the drain electrode, and thus a semiconductor layer is formed (110). By printing (reverse printing) one or two or more kinds of solvent (for example, solvent drops) on the semiconductor layer, the semiconductor layer is subjected to patterning (120). After this, the solvent is made to evaporate (130). COPYRIGHT: (C)2006,JPO&NCIPI
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