COMPONENT ARRANGEMENT WITH AN OPTIMIZED ASSEMBLY CAPABILITY

摘要

The invention relates to a component arrangement comprising: an electronics module (10); a heat sink (20) contacted by the electronics module (10); a printed circuit board (30), and; a fastening means (40) for fastening the electronics module (10) to the printed circuit board (30) and to the heat sink (20). The electronics module (10) has at least one elastic connecting limb (11) for the solder-free contacting of the electronics module (10) with the printed circuit board (30) and has a location (14) for the fastening means (40). The electronics module (10) additionally comprises a decoupling means (12) for decoupling the force of pressure between the connecting limb (11) and the printed circuit board (30) from the contact force between the heat sink (20) and the electronics module (10). Another aspect of the invention concerns an electronics module (10) that can be used in the aforementioned component arrangement.