| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in sensitivity and resolution, and having good mechanical properties even at a low heat treatment temperature. <P>SOLUTION: The positive photosensitive resin composition contains 100 parts by mass of a hydroxypolyamide having a repeating unit represented by formula (1), 1-100 parts by mass of an acrylate compound and 1-100 parts by mass of a photosensitive diazoquinone compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006047377(A) |
申请公布日期 |
2006.02.16 |
| 申请号 |
JP20040224227 |
申请日期 |
2004.07.30 |
| 申请人 |
ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
KATAOKA YASUHIRO;NIWA MOTOHIRO |
| 分类号 |
G03F7/027;C08F290/06;G03F7/004;G03F7/037;G03F7/40;H01L21/027 |
主分类号 |
G03F7/027 |
| 代理机构 |
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