| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealing type semiconductor device containing a large chip in a small package by reducing the physical size of the LSI chip at least in the longitudinal direction, which has a structure that secures a lead embedding length and reduces the mechanical stress at the time of lead formation by reducing the thermal stress of the wire bonding part and each structure part. <P>SOLUTION: This semiconductor device is equipped with: an LSI chip 5 having a plurality of bonding pads 1; and a plurality of leads arranged in the longitudinal direction of this LSI chip 5 that have the predetermined inclination part at least at the internal lead end 7. The bonding pads 1 are arranged in a row in the center of the LSI chip 5, and the tilt angle of the inclination part of each internal lead end 7 is structured so that the angle may become larger as the lead is arranged closer to the end side of the LSI chip. Preferably, the width of the internal lead end 7 is narrowed in the direction towards the bonding pad 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
