MULTILAYER WIRING BOARD, PREFABRICATED MATERIAL FOR MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING MULTILAYER WIRING BOARD, ELECTRONIC COMPONENT, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF FORMING CONDUCTIVE PILLAR

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of configuring by convenient means and having a via connection portion with high reliability, and to provide a high productivity method of manufacturing a multilayer wiring board with high reliability.

SOLUTION: This relates to a multilayer wiring board which uses a conductive pillar in interlayer connection of an interconnection layer. The multilayer wiring board has an interconnection layer whose via-land has a through hole; and when the conductive pillar is connected to the via land formed in the interconnection layer, stress applied between the conductive pillar and the interconnection layer can be released. Furthermore, a portion in contact with the conductive pillar and the via-land has a shape in which an outer side surface of the conductive pillar and the surface of the via-land are smoothly continued, thereby relieving notch effect. Therefore, even when stress is applied to the interlayer connection portion during a manufacturing process of the multilayer wiring board, a packaging process of electronic components, and the like, connection reliability can be secured.

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