MICRO-STRUCTURE, SEALING METHOD OF MICRO-STRUCTURE, MICRO ELECTRO MECHANICAL SYSTEM, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a micro-structure, easily forming a sealed structure using a semiconductor process, and a micro electro mechanical system.

SOLUTION: An enveloping wall part 48 is formed to enclose a micro electro mechanical system body 46 on a substrate 42, and an upper film 49 lowered due to film characteristic is made to closely adhere to the top face of the enveloping wall part 48, thereby sealing the micro electro mechanical system body 46.

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