发明名称 ELECTRODE JOINING STRUCTURE AND JOINING METHOD THEREOF, CONDUCTIVE BONDING AGENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electrode joining structure for obtaining stable conductivity between a couple of electrodes joined using a conductive bonding agent, a joining method thereof, a conductive bonding agent, and a manufacturing method thereof. SOLUTION: In the electrode joining structure, a couple of electrodes 31, 41 are joined by providing, between the two electrodes 31, 41, a conductive bonding agent 2 to attain conductivity through contact of a conductive filler 22 by diffusing the conductive filler 22 into a base resin 21. Fine conductive substance 23 which is smaller in size than the conductive filler 22 and has conductivity is adhered to the surface of the conductive filler 22 in the conductive bonding agent 2 or/and at least one of electrodes 31, 41. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049369(A) 申请公布日期 2006.02.16
申请号 JP20040224415 申请日期 2004.07.30
申请人 DENSO CORP 发明人 NIIOBI AKIRA;UTAKA YUKINORI
分类号 H05K3/32;C09J9/02;C09J11/04;C09J201/00;H01B1/00;H01B1/20;H01B13/00;H01L21/60 主分类号 H05K3/32
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