METHOD FOR MEASURING HEATING PLATE TEMPERATURE, SUBSTRATE PROCESSING EQUIPMENT, AND COMPUTER PROGRAM FOR MEASURING HEATING PLATE TEMPERATURE

摘要

A heating plate (34) performs heat treatment to a substrate (W) by a wireless wafer (Ww) provided with a temperature detecting part (41), a storing part (42) and a controller (42). In the case of measuring the temperature of the heating plate, the temperature can be easily and highly accurately measured and deterioration of operation efficiency due to measuring operation is suppressed. A temperature measurement start instruction is outputted to the controller (42) of the wireless wafer (Ww) at a position in a wireless wafer carrier (Cw), the wireless wafer (Ws) starts temperature detection by the instruction, and time-series data of temperature detection values is stored in the storing part (42). The wireless wafer (Ww) is transferred to a heating unit along a previously determined transfer path. Based on a transfer time until the wireless wafer (Ww) is placed on the heating plate (34) and the time-series data of the temperature detection values in the storing part (42), the time-series data of the temperature detection values after the wireless wafer (Ww) is placed on the heating plate (34) is fetched.