发明名称 MOLDING APPARATUS AND MOLDING METHOD OF RESIN-MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding apparatus and a method of a resin-molded article which can solve the problems that thermal efficiency is bad and cooling time of the molded article is long in the molding apparatus and the method of the resin-molded article by compressing a powder molding material with a molding plate, and which can mold a resin-molded article having approximately uniform thickness and a good mold of a groove and the like. <P>SOLUTION: The molding apparatus of the resin-molded article has a cooling plate 7 attached to at least the first platen 2 of the first platen 2 and the second platen 4 both facing to each other, a molding plate 15 capable of being directly or indirectly heated and having a molding surface 17a for the resin-molded article A molded of the powder molding material B contacting and separating from the cooling plate 7, and a pressurizing mechanism 6 conducting pressurization between the first platen 2 and the second platen 4 with a molding plate 15 and the cooling plate 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006044120(A) 申请公布日期 2006.02.16
申请号 JP20040230062 申请日期 2004.08.06
申请人 MEIKI CO LTD 发明人 KOYAMA HIRONORI;MIYAUCHI SATOSHI
分类号 B29C43/02;B29C43/36;B29L31/34;H01M8/02 主分类号 B29C43/02
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