| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a single-layer polishing pad capable of uniformizing the film thickness distribution in the wafer face while flattening an unevenness pattern on the wafer, and also, capable of suppressing the occurrence of minute polishing flaws. <P>SOLUTION: The polishing pad is composed of a thermoplastic polyurethane resin, which substantially does not have foam, and also, composed so as to include an aramid fiber. When the aramid fiber is dispersed in a resin in a short fiber state, its content is preferable to be 1-20 pts. by mass, based on 100 pts. by mass of a resin. When the aramid fiber exists in the resin in the form of a nonwoven fabric composed of the aramid fiber, its content is preferable to be 20-30 pts. by mass, based on 100 pts. by mass of a resin. Shore D hardness of the thermoplastic polyurethane resin is desirable to be 60 or more. The aramid fiber is desirable to be in a state of being oriented in a pad plane direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
