| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor package by realizing strong adhesion between a lead and mold resin, and also to provide its manufacturing process and a semiconductor device. <P>SOLUTION: The semiconductor device 1 comprises a semiconductor chip 11, a lead 12 for transferring a signal between the semiconductor chip 11 and an external apparatus, a thin metal wire 17, a molding 13 for sealing the lead 12, and a lid member 15. On the surface of the lead 12, a metal oxide film 20 is formed by oxidation. The oxide film is thicker than a native oxide but not thicker than 80 nm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
