| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for executing a test of a plurality of chips in a package in a short time while suppressing the number of terminals of the package. SOLUTION: The semiconductor device comprises a test object chips 3a stored to the package 1a, and a chip 2a stored to the package 1a and at least mounting a test circuit 4a transferring a determination result TR to the outside of the package 1a as serial data by transmitting and receiving a test vector and response data of the test vector to a test object chip 3a as parallel data and determining the presence of trouble in a test object chip 3a. COPYRIGHT: (C)2006,JPO&NCIPI
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