| 摘要 |
A mounting structure is provided to carry out reflow soldering with high connection reliability, and to protect components from heat by improving composition of paste which makes connection with a bump of a low heat resistant component. A mounting structure comprises a plurality of components(1), a substrate(2), a solder connecting part(5a,5b), and a solder resist. Each component has a plurality of solder bumps(3). The substrate has a plurality of lands(4a,4b), wherein the land installed on an outer periphery of the substrate is smaller than that in a center of the substrate. The solder connecting part connects the solder bump and the land. The solder resist is provided on a side of the solder bump connected to the land on the outer periphery. An outer peripheral length of the land on the outer periphery is equal to or 3.7 times larger than a diameter of a circular land on a center of the substrate. |
