| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a stub circuit due to side metallizing without causing deformation of a substrate in a package for a semiconductor device. <P>SOLUTION: The package 10 has a substrate 20 where a side wall forming a first recess 25 with an inside surface is located on a base layer having a mounting portion to mount a semiconductor device. A second recess 60 and a lead terminal fitting pad 40 adjacent to the second recess 60 are formed on the side surface of the side wall. Moreover, the package 10 has an inside wiring 30 including one end formed near the mounting portion on the surface of the first recess 25, and the other end formed at a position which is on the surface of the second recess 60 and is formed apart in a vertical direction from the position where the second recess 60 and a lead terminal fitting pad 40 are adjacent each other. The other end of the inside wiring 30 and the lead fitting pad 40 are connected with a connecting conductor 62 which is formed covering a part of surface of the second recess 60, containing the almost vertical portion on surface of the second recess 60. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
