| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a both-sided printed wiring board which requires no possibility of occurrence of deformation even when a laminated board is used where front and rear metallic foil thicknesses are different from each other, and which is worked easily even when an ultrathin laminated board of≤40μm. SOLUTION: The manufacturing method of a both-sided printed wiring board comprises at least a process of superposing two sheets of first metallic foils; a process of forming one sheet of composite board constituted by pasting apparently two sheets of both-sided metallic foil pasted laminated board, by laminating an insulation resin layer and a second metallic foil consisting of sizes larger than those of a first metallic foil one by one on both of the surfaces of the superposed first metallic foils, or laminating a metallic layer with resin where the insulation resin layer and the second metallic foil are laminated previously on both of the surfaces; a process of forming a via hole connecting the front and rear metallic foils at the desired position of each both-sided metallic foil pasted laminated board; a process of separating the composite substrate to two sheets of both-sided substrates by cut-working on a side inner than the end of the first metallic foil; and a process of carrying out circuit formation of each both-sided substrate after separation. COPYRIGHT: (C)2006,JPO&NCIPI
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