| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device in which electronic components mounted on a wiring circuit board with an excellent connection reliability and a structure suitable for high density mounting. SOLUTION: A wiring pattern not shown is formed on an electronic component 1 mounting surface, and solder balls 3 are provided to connecting electrodes at the outer peripheral edge thereof. These solder balls 3 are electrically connected with the corresponding connecting electrodes provided on a wiring circuit board 2. When the electronic component 1 is a module such as a multi-chip module, a plurality of elements 4 are mounted on the surface side thereof as necessary, a suitable number of such elements as capacitors are provided at predetermined positions on the electronic component 1 mounting surface. Such elements function also as spacer members 5. By decreasing the number of solder balls, a space can be saved. By mounting an element having a height not taller than the solder balls in an available space, electronic components can also be mounted with a high density. COPYRIGHT: (C)2006,JPO&NCIPI
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