| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder capable of enhancing bonding accuracy furthermore. SOLUTION: An arbitrary chip 4 on a monitor screen is recognized (S1), and its initial position coordinate (X0, Y0) is stored (S2). The chip 4 is moved in the X direction by means of an XY table and the after movement coordinate (X1, Y1) is stored (S4). X direction movement and Y direction movement are determined between the initial position coordinate (X0, Y0) and the after movement coordinate (X1, Y1), and the gap angleθof the coordinate axis of a monitor screen to the coordinate axis of the XY table is operated (S5). Coordinate on the XY table is calculated using this gap angleθand the XY table is driven based on this coordinate (S6). COPYRIGHT: (C)2006,JPO&NCIPI
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