| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high heat-dissipation plastic package wherein the exudation of a resin for bonding can be removed easily in a short time with high accuracy. SOLUTION: The method of manufacturing the high heat-dissipation plastic package comprises a process of forming a nearly rectangular cutout in part of a resin film with a copper foil to form a cavity, and a process of stacking the resin film with a copper foil and a copper plate by pasting them together by press. In the high heat-dissipation plastic package, a semiconductor element is arranged on the copper plate exposed in the cavity. In the process of stacking the resin film with a copper foil and the copper plate by pasting them together by press, the press contains a first-stage press and a second-stage press. After the first-stage press and before the second-stage press, a process of removing the exudation of the resin for bonding into the cavity is conducted. COPYRIGHT: (C)2006,JPO&NCIPI
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