| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which can be applied to a high-density, double-sided or multilayer printed wiring board and is provided with a more connection reliable characteristic to improve the interlayer connection relaibility of a conductor circuit made of Cu or Cu alloy, and to provide a method for manufacturing the adhesive sheet and a printed wiring board using the adhesive sheet. SOLUTION: The adhesive sheet connects the interlayer of a conductor circuit made of Cu or Cu alloy, and it is formed of an insulating resin layer and a connection conductor penetrating the insulating resin layer in the direction of thickness thereof and projecting from the front and rear surfaces of the insulating resin layer. The connection conductor is made of Cu-based alloy which mainly contains at least one or more kinds of Sn, Zn, Si, Cr, Ti, Ag, Al, and Mn, and at least 50 mass% or more of Cu as a remaining part. COPYRIGHT: (C)2006,JPO&NCIPI
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