| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion of a negative resist for improving reliability since there are problems such as resist collapses during the copper electroplating, the deformation of the wiring and the short-circuit between wirings because of that the adhesion between the copper sputtered film and the resist is inferior though the wirings are formed on a wafer fitted with a copper sputtered film by copper electroplating after being engraved with the resist. SOLUTION: In order to improve the adhesion between a copper sputtered film and a negative resist, a wafer after being engraved with a resist is subjected to heat treatment. Thus, the resist does not collapse even if copper electroplating is performed. COPYRIGHT: (C)2006,JPO&NCIPI
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