发明名称 |
MOLD, MICROMOLD, MOLD MANUFACTURING METHOD AND MICROMOLD MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold which can prevent an adhesive from being melted into a molded object, a micromold, a mold manufacturing method and a micromold manufacturing method. SOLUTION: The mold has a base material 11 and a micromold 1 with a micropattern 1a arranged on the base material 11 and a fixture 12 which presses the micromold 1 to the base material 11 covering the peripheral edge of the micromold 1. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006044156(A) |
申请公布日期 |
2006.02.16 |
申请号 |
JP20040231155 |
申请日期 |
2004.08.06 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
NAKAMAE KAZUO;NUMAZAWA TOSHIYUKI;OKADA KAZUNORI;TANAKA HIROKAZU |
分类号 |
B29C33/30;B29C33/38 |
主分类号 |
B29C33/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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