发明名称 MOLD, MICROMOLD, MOLD MANUFACTURING METHOD AND MICROMOLD MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold which can prevent an adhesive from being melted into a molded object, a micromold, a mold manufacturing method and a micromold manufacturing method. SOLUTION: The mold has a base material 11 and a micromold 1 with a micropattern 1a arranged on the base material 11 and a fixture 12 which presses the micromold 1 to the base material 11 covering the peripheral edge of the micromold 1. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006044156(A) 申请公布日期 2006.02.16
申请号 JP20040231155 申请日期 2004.08.06
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NAKAMAE KAZUO;NUMAZAWA TOSHIYUKI;OKADA KAZUNORI;TANAKA HIROKAZU
分类号 B29C33/30;B29C33/38 主分类号 B29C33/30
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