| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing yield for the case that a plurality of semiconductor chips mounted on a substrate are resin-sealed in a lump. <P>SOLUTION: This molding die comprises an upper die 30a and a lower die 30b. The lower die 30b is arranged at a position facing a cavity 32 of the upper die 30a, and comprises: a base member 35 having a recessed part 34 recessed from a parting surface 33, a substrate mounting table 36 which can moves vertical direction in the recessed part 34 and is held by a base member 35 by friction resistance to an inner wall surface of the recessed part 34; and a pin 41 for moving the substrate mounting table 36 upward against the base member 35. After moving the substrate mounting table 36 downward by mold clamping force of the upper die and the lower die, the table 36 is fixed with a tapered member 37b so as to move no more downward. After injecting a resin into the cavity and separating the upper die and the lower die, the substrate mounting table is moved upward by the pin 41 to get back the height position of the substrate mounting table 36 to the base member 35 to an initial position. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
