| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems of a conventional method of manufacturing a crystal diaphragm that chipping is caused because air bubbles including an atmosphere in a space for an adhering process may enter a part between the surface of a crystal wafer and an adhesive tape and cutting water used for cutting enters air bubbles (1) and the chipping may has a possibility of incurring characteristic deterioration of individual crystal diaphragms and decrease the yield (2). <P>SOLUTION: The method of manufacturing the crystal diaphragms 13 disclosed herein includes a step of forming through-holes 12 by the photo lithography method and the etching each penetrated through a crystal wafer at each cross point of cutting lines for cutting the crystal wafer into the individual crystal diaphragms in the thickness direction of the crystal wafer by a succeeding step. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
