| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the height along a thickness direction of a substrate to be attached and detached, by reducing the mutual interspacings of a plurality of substrates. <P>SOLUTION: A second contact terminal unit 12 arranged in a position between each contact member of a first contact terminal 10ai and electrically connecting a first printed circuit board 14 and a second printed circuit board 16 each other comprises contact terminals 18ai, 20ai (i=1-10) and support bodies 22, 24 supporting ends of the contact terminals 18ai, 20ai, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
