Conductive/dissipative plastic compositions for molding articles

摘要

A conductive plastic composition comprises a polymeric resin or mixture of polymeric resins; glass fiber; carbon power; and antioxidant. Molding articles formed in accordance with the present invention have an improved shrinkage ratio and surface resistivity. The molding articles of this invention can be used for electrostatic dissipation or antistatic purposes in packages, electronic components, and storage trays. Also disclosed is a method of fabricating a tray comprising molding the composition of the present invention.