| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which improves a productivity of a semiconductor device. <P>SOLUTION: In manufacturing the semiconductor device 1, such a chucking jig 30 is used that has a structure in which the angle of a chucking surface 34b abutting on the semiconductor device 1 varies when a pressure is applied obliquely to the chucking surface 34b, and a chucking pad 34 having the chucking surface 34b is composed of a low resilient material. The angle of the chucking surface 34b varies by an attractive force when the chucking jig 30 is chucked and fixed to the semiconductor device 1, and the chucking pad 34 is formed with a low resilient material which is not deformed by the attractive force when the chucking jig 30 is chucked and fixed to the semiconductor device 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
