| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of electronic parts capable of securing electric conductivity and good heat dissipation performance obtained by bringing a supporting plate into surface contact with a mounting face certainly. SOLUTION: This mounting structure 10 of electronic parts is provided with a supporting plate 13 capable of face contacting via a sheet 12 to a mounting face 11, and a tip 15 placed in the supporting plate 13. Two screws 16 which penetrate two places of the right and left edge in the edge 13A of the supporting plate 13 are attached by screw fitting in a thickness direction to the fitting hole 11A of a mounting face 11. Further, it is provided with a pressing member 18 which presses the tip 15 to the mounting face 11, comprising seats 19 by the side of the right and left in the supporting plate 13 placed by the pressing member 18 and tightened together by the screws 16, and a contact 21 connected with the seats 19 in the right and left sides in elastic contact with the upper surface 15A of the tip part 15. COPYRIGHT: (C)2006,JPO&NCIPI
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