| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method in which plating can be applied to the object to be plated by efficiently suppressing and preventing aggregation of the object to be plated and electrically conductive media while the increase of cost is suppressed without requiring a complicated equipment constitution. SOLUTION: Under the condition that (a) a plating liquid 3, (b) the object 2 to be plated, (c) electrically conductive media 4, and (d) stirring media 5 of cracking aggregates 5 containing the object 2 and the electrically conductive media 4 generated in the vicinity of a cathode electrode 12 during plating and further stirring the object 2 are present in a plating treatment chamber 1, while continuously or discontinuously rotating the plating treatment chamber 1 in such a manner that a change is caused in the rotational speed, the plating is performed. Further, in the process of performing the plating, the relation between the rotating conditions in the plating treatment chamber 1 and the weight of each stirring media 5 is decided in such a manner that each stirring media 5 have the kinetic energy of≥0.015 J. COPYRIGHT: (C)2006,JPO&NCIPI
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