发明名称 MOLDING DIE AND MOLDING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a molding die capable of preventing a matter to be molded from entering between die themselves, capable of easily releasing the matter to be molded, capable of preventing the deformation of the matter to be molded, capable of controlling dimensional accuracy in an outer peripheral and height direction of the matter to be molded and also capable of easily densifying the matter to be molded and to provide the molding method using the molding die. SOLUTION: The molding die is provided with a drum die 3 having a hollow space, an upper die 1 and a lower die 2 inserted in the hollow space, and the matter to be molded 5 is molded by the upper die 1 and the lower die 2 in the hollow space, and the molding die has a ring member 4 arranged between the upper die and the matter to be molded 5 in the hollow space of the drum die 3 and arranged along a wall surface of the drum die 3 in the hollow space. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006045038(A) 申请公布日期 2006.02.16
申请号 JP20040232391 申请日期 2004.08.09
申请人 SUMITOMO ELECTRIC IND LTD 发明人 HASEGAWA MIKITO;FUJII AKITO
分类号 C03B11/08;C03B11/00 主分类号 C03B11/08
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