| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated device which allows a mounting component to be soldered to a mount without impairing the precision of a soldering position where the mounting component is soldered to the mount. <P>SOLUTION: The semiconductor integrated device comprises: the mounting component which has a soldering wet property and a soldering face smaller in outer diameter than the mounting component inside the undersurface of the mounting component, the soldering face projecting down out of the outer side face of the mounting component; the mount which is encircled with a solder resist 3a having no soldering wet property and has a soldering resist opening 21 that has a soldering wet property and bears the soldering face of the mounting component; and solder 2a which bonds the soldering face of the mounting component to the soldering resist opening 21 of the mount. The soldering resist opening 21 of the mount is encircled with the soldering resist 3a in such a way that narrow parts slightly larger in outer diameter than the soldering face of the mount and wider parts larger in outer diameter than the mounting component are next to each other at each side of the opening 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
