| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing tape suitable for a flip chip fittable process. SOLUTION: The wafer processing tape has a tackifier layer (2) and an adhesive layer (3) on a backing film (1), and in a state that the tape is adhered to a wafer circuit substrate (5) having a projection type metal electrode (4), a polishing step of polishing the back face of the wafer circuit substrate, and a dicing step of dicing the wafer circuit substrate are performed. Also, in the wafer processing tape, in a step of picking up the diced chips, the chips are picked up in a state that the adhesive layer (3) is separated from the backing film (1), and is adhered to the chips. COPYRIGHT: (C)2006,JPO&NCIPI |
