发明名称 Water-cooling heat dissipation device adopted for modulized LEDs
摘要 A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.
申请公布号 US2006034085(A1) 申请公布日期 2006.02.16
申请号 US20040915539 申请日期 2004.08.11
申请人 HARVATEK CORPORATION 发明人 WANG BILY;CHUANG JONNIE;LEE HENG-YEN
分类号 F21V29/00 主分类号 F21V29/00
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