发明名称 |
Ceramic package, assembled substrate, and manufacturing method therefor |
摘要 |
In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.
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申请公布号 |
US2006033200(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20050198135 |
申请日期 |
2005.08.08 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
NAGANO NATSUYO;OGURA TAKASHI;HONGO MASANORI;FUKUYAMA MASAMI |
分类号 |
H01L23/053 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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