Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

摘要

An MMIC (Microwave Monolithic Integrated Circuit)-mounted substrate includes a double-metal-foil dielectric substrate having a dielectric substrate with a metal foil pattern formed on both sides of the substrate, an MMIC that is a surface-mount high power amplifier mounted on one side of the double-metal-foil dielectric substrate, and a metal chassis attached to the other side of the double-metal-foil dielectric substrate. The double-metal-foil dielectric substrate has a plurality of through holes. A copper foil pattern that is a metal foil pattern continuously extends to cover the inner surfaces of the through holes and both sides of the dielectric substrate, and solder is buried in the through holes.