发明名称 |
Semiconductor device with sidewall wiring |
摘要 |
Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring. |
申请公布号 |
US2006033198(A1) |
申请公布日期 |
2006.02.16 |
申请号 |
US20050206146 |
申请日期 |
2005.08.18 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
NOMA TAKASHI;SHINOGI HIROYUKI;TAKAI NOBUYUKI;KITAGAWA KATSUHIKO;TOKUSHIGE RYOJI;OTAGAKI TAKAYASU;ANDO TATSUYA;OKIGAWA MITSURU |
分类号 |
H01L23/04;H01L23/31;H01L23/485 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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