Pakning af optoelektronisk komponent på waferniveau

摘要

An optical chassis (5) includes a mount substrate (10) an optoelectronic device (12) on the mount substrate (10), a spacer layer (20), and a sealer layer (30). The mount substrate (10), the spacer layer (20) and the sealer layer (30) are vertically stacked and hermetically sealing the optoelectronic device (12). An external electrical interconnection (18,62,64) for the optoelectronic device (12) is provided outside the sealing (30). At least part of the optical chassis (5) may be made on a wafer level. A passive optical element (44) may be provided on the sealer layer (30) or on another substrate stacked and secured thereto.