发明名称 SUPPLYING METHOD OF SOLDERING MATERIAL AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To supply a soldering material comprising a mixture of solder particles and a liquid having fluxing action onto a workpiece, in a state that the soldering particles are uniformly dispersed in the liquid. SOLUTION: A supplying device 10 of soldering material comprises a supplying means 11, a storing means 12, a circulating means 13 and a stirring means 14, and supplies, onto the workpiece W, the soldering material S which comprises the mixture of the solder particles and the liquid which has fluxing action and in which the solder particles precipitate. The supplying means 11 supplies the soldering material S onto the workpiece W and also supplies the soldering material S to the storing means 12 during waiting time until the soldering material S is supplied onto the next workpiece W. The storing means 12 temporarily stores the soldering material S supplied from the supplying means 11. The circulating means 13 circulates the soldering material S from the storing means 12 to the supplying means 11. The stirring means 14 stirs the soldering material S circulated by the circulating means 13. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006043737(A) 申请公布日期 2006.02.16
申请号 JP20040228859 申请日期 2004.08.05
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SHIRAI MASARU;ONOZAKI JUNICHI
分类号 B23K3/06;B23K101/40;B23K101/42;H01L21/60;H05K3/34 主分类号 B23K3/06
代理机构 代理人
主权项
地址