| 发明名称 |
Thermal protection for electronic components during processing |
| 摘要 |
A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.
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| 申请公布号 |
US2006035413(A1) |
申请公布日期 |
2006.02.16 |
| 申请号 |
US20040755944 |
申请日期 |
2004.01.13 |
| 申请人 |
COOKSON ELECTRONICS, INC. |
发明人 |
RAE ALAN;SINGH BAWA |
| 分类号 |
H01L21/50;G01R31/02;H01L21/60;H01L23/36 |
主分类号 |
H01L21/50 |
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