ELECTRIC COMPONENT WITH A FLIP-CHIP CONSTRUCTION

摘要

The invention relates to an electric component comprising a carrier substrate (1), which has a thermal expansion coefficient a_p and a chip (2), which is fixed onto the carrier substrate (1) in a flip-chip construction by means of bumps (31 to 34). In a preferred orientation x₁, the chip (2) has a thermal expansion co-efficient a₁, whereby ?a₁ = |a_p - a₁| represents the first expansion differential. In a second preferred orientation x₂, the chip (2) has a thermal expansion coefficient a₂, whereby ?a₂ = |a_p - a₂| represents the second expansion differential. ?x₁ is the distance between the centres (310, 320) of the terminal bumps (31, 32) in the x₁ orientation. ?x₂ is the distance between the centres (330, 340) of the terminal bumps (33, 34) in the x₂ orientation. The following applies: ?x₁ < ?X₂ when ?ax₁ > ?a₂ and ?x₁ > ?x₂ when ?a₁ < ?A₂. This enables the shear force that occurs during temperature modifications and that acts on the terminal bumps to be minimised.