CAPACITANCE ELEMENT, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CIRCUIT

摘要

Provided is a capacitance element which can effectively reduce a high-frequency noise generated in a circuit. A capacitance element includes a capacitance forming unit (100) of a shape having a closed surrounding to separate the inner portion from the outer portion. A capacitance forming unit (100) is formed by an electrode (110), an opposing electrode (111), and a dielectric layer (120). The capacitance element (1) includes at least one pull-out terminal at the outer portion and the inner portion of the electrode (110) (at least one outer circumferential portion pull-out terminal (140) and at least one inner circumferential portion pull-out terminal (130)). The capacitance element is mounted inside a substrate or on the substrate surface so as to constitute a printed circuit board. The capacitance element 1 is arranged in an object semiconductor circuit unit so as to constitute a semiconductor package. Moreover, the capacitance element is arranged in an object function circuit unit (301) so as to constitute a semiconductor circuit.