| 摘要 |
A device is provided for removal of a layer, such as a label, from a cylindrical surface of an object. The device includes a guide, a cutting instrument, and a base connecting the guide and the cutting instrument. The guide and the cutting instrument are separated by a distance defined by the base, and the cutting instrument is positioned to shave along the object's surface to remove the layer, when the surface of the object is rotated against the cutting instrument and against the guide. The method includes, positioning an object in a device having a cutting instrument and a guide, where the cutting instrument and the guide both support the object, and where the cutting instrument is positioned to shave along the surface to remove the layer when the object is rotated; and rotating the object so the cutting instrument shaves under the layer to remove the layer.
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