PROCESS FOR MANUFACTURING A MULTI-LAYER CIRCUIT BOARD

摘要

A circuit board is manufactured having a structure which includes a plurality of supporting layers each of different materials. The supporting layers support electrically conducting patterns. Each of the materials has a different melting point. The material for the first supporting layer has the highest melting point of the different materials for supporting layers. Beginning from the first supporting layer, new supporting layers are arranged successively. Each new supporting layer has a lower melting point than that of the material of the supporting layer which is closest in the direction of the first supporting layer. Each new supporting layer is attached to the structure by exposing the structure to a temperature which exceeds the melting point of the new supporting layer but is lower than the melting point for that supporting layer which is the closest in the direction of the first supporting layer. Electrically conducting patterns are arranged on at least one side of each supporting layer and the electrically conducting patterns on at least two supporting layers are connected to each other.